1999

A stochastic inventory model with perishable and aging items

LotfiTadj, Journal Article, , A stochastic inventory model with perishable and aging items. (1999). Journal of Applied Mathematics and Stochastic Analysis 12 (1), 23-29, 1999.

1999

Effects of surface roughness on the diffusion bonding of Al alloy 6061 in air

ZuruziAbu Samah, Journal Article, , Effects of surface roughness on the diffusion bonding of Al alloy 6061 in air. (1999). Materials Science and Engineering: A 270 (2), 244-248, 1999.

1999

Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions

ZuruziAbu Samah, Journal Article, , Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions. (1999). Journal of Electronic Materials 28 (11), 1224-1230, 1999.

1999

STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER (PACS 61-68, 78)-Roughness evolution of Cu6Sn5 intermetallic during soldering

ZuruziAbu Samah, Journal Article, , STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER (PACS 61-68, 78)-Roughness evolution of Cu6Sn5 intermetallic during soldering. (1999). Journal of Applied Physics 86 (9), 4916-4921, 1999.

1999

STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER-Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

ZuruziAbu Samah, Journal Article, , STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER-Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow. (1999). Applied Physics Letters 75 (23), 3635-3637, 1999.

1999

Roughness evolution of CuSn intermetallic during soldering

ZuruziAbu Samah, Journal Article, , Roughness evolution of CuSn intermetallic during soldering. (1999). Journal of Applied Physics 86 (9), 4916-4921, 1999.

1999

A hysteretic queueing system with random server capacity

LotfiTadj, Journal Article, , A hysteretic queueing system with random server capacity. (1999). Computers & Mathematics With Applications 38 (1), 51-61, 1999.

1999

Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

ZuruziAbu Samah, Journal Article, , Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow. (1999). Applied Physics Letters 75 (23), 3635-3637, 1999.

1999

The usability of blast furnace slag in the production of high strength concrete

RamazanDemirboga, Journal Article, , The usability of blast furnace slag in the production of high strength concrete. (1999). Fifth International Symposium on Utilization of High Strength High …, 1999.

1998

On a delayed service queueing system with random server capacity and impatient customers

LotfiTadj, Journal Article, , On a delayed service queueing system with random server capacity and impatient customers. (1998). Appl. Stat. Sci. 3, 309-328, 1998.